1.Replace the tradional circling of jump wire to filled the missing solder joint ,restore to the original pad and without trace 2.The pads are reinforced with fixed pins and will never fall off
3.It adopts industrial-grade printed circuit board copper foil with a thickness of 30¥ìm 4.Good flatness,which can prevent pseudo soldering effectively caused by unevenness
5.The connection joint with the circuit is firm ,and can fixed the green oil(UV curing solder mask ink)well
6.It saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high
7.The BGA bonding surface has saturation ,stable electrical performance ,good welding strength ,and it is not easy to drop off and unsoldering.
