Product specifications: Each bottle contains about 25,000 tin solder balls, 0.3-0.76mm, including 9 sizes, to meet your basic welding needs, with good practicability
Function: Reballing stencils to connect semiconductor wafers and circuit template machine PCB board, transmit electronic to ultra small tin electronic parts
Professional Manufacturing: BGA bead add trace elements, improve the oxidation resistance and reliability of the tin ball, to provide effective service for your welding work
Easy to Operate: Reballing stencils operation is simple, can be directly welded, suitable for PCB board GPU CPU IC chip circuit module connection
Tips: The larger the BGA solder ball model, the larger the particles, the more in the bottle, on the contrary, the smaller the model, the less in the bottle, 0.76mm is full bottle
