About this item

• ALUMINUM ALLOY: The BGA reballing station combines lightweight portability with steady support for repeated heating cycles during component repairs
• EASY TO USE: The BGA reballing stencil is marked on the exterior, convenient for you to choose and use them on the reballing station
• CHIP COMPATIBILITY: This BGA reball stencil handles chips from 9mm to 43mm, using metal plating to help heat spread evenly during reflow
• DIVERSION GROOVE: The reballing kit includes adjustable sizing dials and spillway channels to quickly remove extra solder without interrupting tasks
• APPLICATION: The BGA rework station can be used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding