¡¼Product size¡½Packing size: 10 cm x 5 cm x 1.5 cm Net Weight Of Paste: 35g
¡¼High solderability¡½A high-performance thixotropic agent is added to the solder to make the solder paste highly active. The solder is significantly moistened during the soldering process, thereby reducing the phenomenon of false soldering.
¡¼Practical design¡½Plunger injection needle features: Reflow soldering will not produce tin beads and tin bridges.
¡¼Application¡½Low-temperature tin is often used in the repair of electronic products. Low-temperature tin is mainly used for items that cannot withstand the high temperature of the device. For example, electronic components that cannot withstand high temperatures.
¡¼scope of application¡½Paper circuit boards that cannot withstand high temperatures, upper structure flexible circuit boards, LED light bars, small components, and mobile phone repair covers.
