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Souvela

Tin Solder Ball BGA,Solder Cleaning Balls,0.25 0.3 0.35 0.4 0.45 0.5 0.6mm Reballing for GPU CPU IC PCB Chip Used for Connection of semiconductor chip (7 Bottles£©

Tin Solder Ball BGA,Solder Cleaning Balls,0.25 0.3 0.35 0.4 0.45 0.5 0.6mm Reballing for GPU CPU IC PCB Chip Used for Connection of semiconductor chip (7 Bottles£©

Regular price $41.95 USD
Regular price $76.99 USD Sale price $41.95 USD
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  • TIN MATERIAL: These solder balls are made of good quality tin material, stable, durable and can be used for a long time£¨This solder cleaning ball contains lead£©
  • MEET YOUR BASIC NEED: 12500 premium tin solder balls BGA per bottle to ensure you have an ample supply for your projects. Each solder ball is small yet powerful for transmitting electronic signals effortlessly
  • MANY DIFFERENT SIZES: Achieve flawless reworking with these top-notch BGA balls, ensuring precise and reliable connections every time. Opt for 9 bottles to access a range of sizes for versatility. Specifications: 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6mm
  • TRANSMIT SIGNALS FOR WELDING: Tin solder balls are very small, can transmit electronic signals, very useful for welding work
  • WIDE APPLICATION: Solder cleaning balls are mainly used to connect semiconductor chips, circuit templates and PCB boards, and ultra small spherical tin electronic parts that transmit electronic signals
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